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Author

  • Baron, Philipp (1)
  • Bartels, Albrecht (1)
  • Bastian, Georg (1)
  • Beck, Matthias (1)
  • Dekorsy, Thomas (1)
  • Faist, Jerome (1)
  • Fischer, Georg (1)
  • Fischer, Milan (1)
  • Gebs, Raphael (1)
  • Hilser, Florian (1)
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Year of publication

  • 2010 (1)
  • 2022 (1)

Document Type

  • Article (specialist journals) (2)

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  • English (2)

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Keywords

  • Elektrischer Leiter (1)
  • Konfokale Mikroskopie (1)
  • Kupfer (1)
  • Rauigkeit (1)
  • Spektroskopie (1)
  • Terahertzbereich (1)
  • confocal microscopy (1)
  • copper conductors (1)
  • including semiconductors (1)
  • material extrusion (1)
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  • FB Technik (2)

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Terahertz emission from lateral photo-Dember currents (2010)
Klatt, Gregor ; Hilser, Florian ; Qiao, Wenchao ; Beck, Matthias ; Gebs, Raphael ; Bartels, Albrecht ; Huska, Klaus ; Lemmer, Uli ; Bastian, Georg ; Johnston, Michael B. ; Fischer, Milan ; Faist, Jerome ; Dekorsy, Thomas
The photo-Dember effect is a source of impulsive THz emission following femtosecond pulsed optical excitation. This emission results from the ultrafast spatial separation of electron-hole pairs in strong carrier gradients due to their different diffusion coefficients. The associated time dependent polarization is oriented perpendicular to the excited surface which is inaptly for efficient out coupling of THz radiation. We propose a scheme for generating strong carrier gradients parallel to the excited surface. The resulting photo-Dember currents are oriented in the same direction and emit THz radiation into the favorable direction perpendicular to the surface. This effect is demonstrated for GaAs and In(0.53)Ga(0.47)As. Surprisingly the photo-Dember THz emitters provide higher bandwidth than photoconductive emitters. Multiplexing of phase coherent photo-Dember currents by periodically tailoring the photoexcited spatial carrier distribution gives rise to a strongly enhanced THz emission, which reaches electric field amplitudes comparable to a high-efficiency externally biased photoconductive emitter.
Surface roughness and its structural orientation caused by internal microstructural changes in mechanically stressed copper conductors (2022)
Baron, Philipp ; Lenz, Philipp ; Schomer, Maria ; Koch, Klaus P. ; Wittmann, Armin ; Fischer, Georg
In this paper, the mechanical damage behavior is investigated based on the characteristic roughness on the surface and the orientation of superficial structures. The main goal is to explore the surface roughness on mechanically loaded copper conductors as a lifetime indicator. For this purpose, copper conductors are mechanically stressed in accordance with EN 50,396 and then examined metallographically and microscopically. The microstructure examination shows that the roughness is caused by material extrusion and cracks due to work hardening in the surface area. Using confocal microscopy, it is shown for the first time that significant formation of surface roughness takes place over the service life of copper conductors. The roughness increases monotonically, but not linearly with number of cycles, due to internal microstructural processes and can be divided into three sections. First inspections of the conductor surface over lifetime show a correlation between the intensity of structures orientated 45° to the loading direction and the roughness. This phenomenon, already known from microscopic slip lines, is thus also evident in macroscopic roughness formation and is well founded by the research theory on material extrusion along dislocation lines. In summary, a lifetime determination is possible based on its developing roughness which enables the utilization as a sensor element.
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