TY  - JOUR
A1  - Baron, Philipp
A1  - Lenz, Philipp
A1  - Schomer, Maria
A1  - Koch, Klaus P.
A1  - Wittmann, Armin
A1  - Fischer, Georg
T1  - Surface roughness and its structural orientation caused by internal microstructural changes in mechanically stressed copper conductors
T2  - Journal of Materials Science
N2  - In this paper, the mechanical damage behavior is investigated based on the characteristic roughness on the surface and the orientation of superficial structures. The main goal is to explore the surface roughness on mechanically loaded copper conductors as a lifetime indicator. For this purpose, copper conductors are mechanically stressed in accordance with EN 50,396 and then examined metallographically and microscopically. The microstructure examination shows that the roughness is caused by material extrusion and cracks due to work hardening in the surface area. Using confocal microscopy, it is shown for the first time that significant formation of surface roughness takes place over the service life of copper conductors. The roughness increases monotonically, but not linearly with number of cycles, due to internal microstructural processes and can be divided into three sections. First inspections of the conductor surface over lifetime show a correlation between the intensity of structures orientated 45° to the loading direction and the roughness. This phenomenon, already known from microscopic slip lines, is thus also evident in macroscopic roughness formation and is well founded by the research theory on material extrusion along dislocation lines. In summary, a lifetime determination is possible based on its developing roughness which enables the utilization as a sensor element.
KW  - Rauigkeit
KW  - Elektrischer Leiter
KW  - Kupfer
KW  - Konfokale Mikroskopie
KW  - surface roughness
KW  - copper conductors
KW  - confocal microscopy
KW  - material extrusion
Y1  - 2022
UR  - https://hst.opus.hbz-nrw.de/frontdoor/index/index/docId/150
UR  - https://nbn-resolving.org/urn:nbn:de:hbz:tr5-1503
VL  - 57
IS  - 32
SP  - 15549
EP  - 15559
PB  - Springer
ER  -